March 9, 2002

I wanted to take time out of my schedule to describe our training experience provided by 48 Rotchild St. P.O.B 277 Rishon Le Zion 75200, ISRAEL and their Wave Solder Process Instructor. The presentation was attended by 30 of my engineers, technicians, operators and senior staff who are part of our wave solder team and whose responsibilities are spread across our 6 wave machines.

The presentation delivered a solid basis on the variables involved in the entire wave solder process from chemistry to wave machine. While at our wave machine we were able to see that solder quality really is determined by how the boards pass through the wave.

Your trainer was able to identify that many of our single-sided boards that had insufficient solder joints were directly related to board manufacturing techniques causing burrs to form in through-holes. These burrs caused the fillets to be cut upon exiting the solder wave and therefore creating the insufficient solder joints.

With effective use of your Wave Solder Optimizer, your instructor showed us how to adjust variables related to decreasing solder temperature and increasing immersion depth and dwell times to address the defects. We now have an improved process in place to prevent this type of reoccurance.

During the presentation, my entire staff asked many questions that were addressed in a straightforward, professional manner. The instructor's attention to detail throughout the class was greatly appreciated by us all.

The additional half-day of process consultation was extremely beneficial. Your trainer provided us with written procedures which will improve our overall process.

I would recommend this course and process consultation to anyone involved with controlling their Wave Solder Process. Thank you for the many benefits of this presentation.

Sincerely,

Ernesto Moreno
Samsung Electronics